Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis
- 1 October 1999
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (10) , 1127-1137
- https://doi.org/10.1007/s11664-999-0250-4
Abstract
No abstract availableKeywords
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