Thermal performance comparison of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages
- 1 May 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 19 (2) , 427-443
- https://doi.org/10.1109/96.496048
Abstract
No abstract availableKeywords
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