Heterogeneously integrated III-V/silicon distributed feedback lasers
- 12 December 2013
- journal article
- Published by Optica Publishing Group in Optics Letters
- Vol. 38 (24) , 5434-5437
- https://doi.org/10.1364/ol.38.005434
Abstract
Heterogeneously integrated III-V-on-silicon second-order distributed feedback lasers utilizing an ultra-thin DVS-BCB die-to-wafer bonding process are reported. A novel DFB laser design exploiting high confinement in the active waveguide is demonstrated. A 14 mW single-facet output power coupled to a silicon waveguide, 50 dB side-mode suppression ratio and continuous wave operation up to 60°C around 1550 nm is obtained.Keywords
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