Influence of film density on residual stress and resistivity for Cu thin films deposited by bias sputtering
- 1 January 2000
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 358 (1-2) , 202-205
- https://doi.org/10.1016/s0040-6090(99)00709-9
Abstract
No abstract availableThis publication has 16 references indexed in Scilit:
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