Thermal interaction of semiconductor devices on copper-clad ceramic substrates
- 9 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Comparative thermal performances of various substrate materials in a simple packaging application: actual vs. predictedPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Thermally Conductive Ceramics for Electronic PackagingJournal of Electronic Packaging, 1989
- Ceramic Materials for Electronic PackagingJournal of Electronic Packaging, 1989
- On the Nondimensionalization of Constriction Resistance for Semi-infinite Heat Flux TubesJournal of Heat Transfer, 1989
- Thermal analysis of integrated circuit devices and packagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Computerized Thermal Analysis of Hybrid CircuitsIEEE Transactions on Parts, Hybrids, and Packaging, 1977
- Spreading Resistance in Cylindrical Semiconductor DevicesJournal of Applied Physics, 1960