The influence of passivation and packaging on electromigration
- 31 May 1987
- journal article
- Published by Elsevier in Solid-State Electronics
- Vol. 30 (5) , 493-496
- https://doi.org/10.1016/0038-1101(87)90203-6
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- The effect of passivation thickness on the electromigration lifetime of Al/Cu thin film conductorsJournal of Vacuum Science & Technology A, 1983
- Electromigration in fine-line sputter-gun AlJournal of Applied Physics, 1980
- Procurement specification requirements for protection against electromigration failures in aluminium metallizationsMicroelectronics Reliability, 1979
- Coating, Mechanical Constraints, and Pressure Effects on ElectromigrationApplied Physics Letters, 1972
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969