Carbon in GaAs: Implantation and isolation characteristics

Abstract
Carbon was implanted into GaAs at doses between 1013 and 5×1014 cm2, either by itself or with Ga coimplantation at room temperature or 200 °C. Activation percentages as high as 40% were obtained for C+Ga implants at 5×1014 cm2 compared to 106 Ω/⧠) layers in C‐doped (p∼2×1020 cm3) GaAs is possible by using oxygen bombardment doses above 5×1014 cm2. Under these conditions the evolution of the implanted layer resistivity with annealing temperature can be described by the usual trap‐related compensation mechanism.