Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure
- 1 November 2003
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 32 (11) , 1303-1309
- https://doi.org/10.1007/s11664-003-0027-0
Abstract
No abstract availableKeywords
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