Abstract
Pseudomorphic Si1-xGex (0.151-yCy (0.0081-xGex/Si system, strain relaxation could be observed, which is explicable in terms of the introduction of misfit dislocations at the interface. At temperatures of about 1000 degrees C an additional effect, the interdiffusion of Si and Ge and thus the decrease in the Ge concentration inside the layer, enhances the relief of the strain. Both effects were separately measurable and the diffusion coefficient was determined in its dependence on the Ge content. On the other hand, in the tensile strained Si1-yCy/Si system the nucleation and diffusion-controlled growth of SiC nanocrystals was found to be the dominant mechanism at temperatures above 800 degrees C, decreasing the amount of C atoms on substitutional sites and thus relieving the strain in the layer.