Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow
- 1 October 2002
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 31 (10) , 1117-1121
- https://doi.org/10.1007/s11664-002-0051-5
Abstract
No abstract availableKeywords
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