Silicon direct bonding for sensor applications: Characterization of the bond quality
- 1 October 1990
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 25 (1-3) , 87-92
- https://doi.org/10.1016/0924-4247(90)87013-9
Abstract
No abstract availableKeywords
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