Electrical properties of superfilled sub-micrometer silver metallizations

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Abstract
Electrical properties of damascene silver wires with widths between ≈60 and 840 nm and heights between ≈100 nm and 300 nm are presented. The superconformal electrodeposition process by which the seam-free and void-free metallizations were fabricated is summarized. The chemical-mechanical polishing plus oblique ion sputtering process by which metal overburden was removed from the field adjacent to the wires is detailed. The size-dependent resistivity of the wires is obtained and interpreted in terms of intrinsic resistivity, grain boundary reflection, and surface scattering. Quantitative analysis of the last is accomplished using a different implementation of the Fuchs-Sondheimer formalism for wires of rectangular geometry and nonzero surface specularity that is derived herein.