Influence of the target composition on the discharge voltage during magnetron sputtering
- 5 October 2006
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 201 (3-4) , 848-854
- https://doi.org/10.1016/j.surfcoat.2005.12.047
Abstract
No abstract availableThis publication has 12 references indexed in Scilit:
- Effect of the oxygen deficiency of ceramic TiO2−x targets on the deposition of TiO2 thin films by DC magnetron sputteringSurface and Interface Analysis, 2004
- Calculation of the effective gas interaction probabilities of the secondary electrons in a dc magnetron dischargeJournal of Physics D: Applied Physics, 2004
- Target voltage behaviour during DC sputtering of silicon in an argon/nitrogen mixtureVacuum, 2002
- Cross section for removing chemisorbed oxygen from an aluminum target by sputteringJournal of Vacuum Science & Technology A, 2002
- Influence of oxygen addition on the target voltage during reactive sputtering of aluminiumPlasma Sources Science and Technology, 2001
- Influence of gas pressure and magnetic field upon dc magnetron dischargeVacuum, 2001
- A self-consistent numerical analysis of a planar dc magnetron discharge by the particle-in-cell/Monte Carlo methodJournal of Physics D: Applied Physics, 1999
- Plasma chemistry model of DC magnetron reactive sputtering in Ar O2 gas mixturesThin Solid Films, 1998
- The current-voltage characteristic of magnetron sputtering systemsJournal of Applied Physics, 1983
- Magnetron sputtering: basic physics and application to cylindrical magnetronsJournal of Vacuum Science and Technology, 1978