Application of Surface Analysis for Electronic Devices
- 1 January 1980
- book chapter
- Published by ASTM International
Abstract
The principles of Auger electron spectroscopy, X-ray photoelectron spectroscopy, ion scattering spectroscopy, and secondary ion mass spectrometry are discussed, and their applications in the processing of electronic devices are illustrated. Electronic device processing is divided into five areas: (1) substrate and substrate processing, (2) deposited films, (3) patterning, (4) interconnection, and (5) compatibility. Examples are given in each area in which surface analysis has been used to great advantage in solving processing problems and improving technology.Keywords
This publication has 29 references indexed in Scilit:
- PrefaceSurface Science, 1977
- The Auger analysis of contaminants that influence the thermocompression bonding of goldThin Solid Films, 1977
- Detection of Al and Mg contamination in sputtered Pt films by Auger electron spectroscopy and secondary ion mass spectrometryThin Solid Films, 1976
- In situ formation of diffusion barriers in thin film metallization systemsThin Solid Films, 1976
- The analysis of solid surfaces by low energy ion scattering spectroscopyJournal of Colloid and Interface Science, 1976
- Correlations between interfacial oxides and resistance changes for W contacts on heavily doped Si-GeThin Solid Films, 1975
- Photoemission and energy loss spectroscopy on semiconductor surfacesSurface Science, 1975
- Surface investigation of solids by the statical method of secondary ion mass spectroscopy (SIMS)Surface Science, 1973
- Ultraviolet depolymerization of photoresist polymersPolymer Engineering & Science, 1972
- Auger electron spectroscopySurface Science, 1971