Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold
- 15 May 2004
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 14 (7) , 884-890
- https://doi.org/10.1088/0960-1317/14/7/007
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
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