Low-temperature intermediate Au-Si wafer bonding; eutectic or silicide bond
- 10 July 1997
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 62 (1-3) , 680-686
- https://doi.org/10.1016/s0924-4247(97)01550-1
Abstract
No abstract availableKeywords
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