Virtual thermo-mechanical prototyping of electronic packaging-the bottlenecks and solutions for damage modeling
- 11 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 263-269
- https://doi.org/10.1109/eptc.2000.906384
Abstract
This paper presents the strategy and methodology for virtual thermo-mechanical prototyping of electronic packages specified by Philips. The focus is on the bottlenecks and solutions for damage modeling in virtual thermo-mechanical prototyping. It demonstrates that the capability to understand and develop reliable damage models and criteria at both macro and micro levels is vital for virtual thermo-mechanical prototyping. As a conclusion, by combining the strengths of reliable simulation models with an advanced optimization strategy, virtual prototyping can be used in packaging development to achieve greater business profitability.Keywords
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