Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow
- 27 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 17 references indexed in Scilit:
- Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow processPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Influence of temperature, humidity and defect location on delamination in plastic IC packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Bimaterial interfacial crack growth as a function of mode-mixityIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995
- Predicting delamination in plastic IC packages and determining suitable mold compound propertiesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1994
- Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination Within Package.TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 1994
- Cracks on bimaterial interfaces: elasticity and plasticity aspectsMaterials Science and Engineering: A, 1991
- Biaxial Loading Experiments for Determining Interfacial Fracture ToughnessJournal of Applied Mechanics, 1991
- Mixed Mode Cracking in Layered MaterialsPublished by Elsevier ,1991
- A Path Independent Integral and the Approximate Analysis of Strain Concentration by Notches and CracksJournal of Applied Mechanics, 1968
- The strength of adhesive joints using the theory of cracksInternational Journal of Fracture, 1965