Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects
- 1 December 2003
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 32 (12) , 1527-1533
- https://doi.org/10.1007/s11664-003-0125-z
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with CuMicroelectronics Reliability, 2003
- Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additionsMaterials Science and Engineering: A, 2003
- Failure mechanism of lead-free solder joints in flip chip packagesJournal of Electronic Materials, 2002
- Mechanical characterization of Sn–Ag-based lead-free soldersMicroelectronics Reliability, 2002
- Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder jointsJournal of Electronic Materials, 1999
- Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic soldersJournal of Electronic Materials, 1997
- The mechanical behavior of interconnect materials for electronic packagingJOM, 1996
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994