Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu
- 1 February 2003
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 43 (2) , 259-267
- https://doi.org/10.1016/s0026-2714(02)00239-1
Abstract
No abstract availableThis publication has 17 references indexed in Scilit:
- Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloysPublished by Elsevier ,2002
- Mechanical reliability in electronic packagingMicroelectronics Reliability, 2002
- Lead‐free reflow soldering for electronics assemblySoldering & Surface Mount Technology, 2001
- Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder jointsMicroelectronics Reliability, 2001
- The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructureJournal of Electronic Materials, 2001
- Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic SolderMATERIALS TRANSACTIONS, 2001
- Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloysJournal of Electronic Materials, 2000
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloysJournal of Electronic Materials, 2000
- Tin-silver-copper eutectic temperature and compositionMetallurgical and Materials Transactions A, 2000
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994