The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure
- 1 September 2001
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 30 (9) , 1157-1164
- https://doi.org/10.1007/s11664-001-0144-6
Abstract
No abstract availableKeywords
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