Hole formation in thin aluminium films under controlled variation of strain and temperature
- 1 March 1991
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 197 (1-2) , 67-83
- https://doi.org/10.1016/0040-6090(91)90222-j
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
- X-ray diffraction determination of the effect of various passivations on stress in metal films and patterned linesJournal of Applied Physics, 1990
- Relationship of ambient deposition conditions to formation of thermally activated voids in Al/Si interconnectsJournal of Vacuum Science & Technology B, 1990
- Thermal dependence of voiding in narrow aluminum microelectronic interconnectsApplied Physics Letters, 1989
- Voiding due to thermal stress in narrow conductor linesScripta Metallurgica, 1989
- Influence of surface coatings on elasticity, residual stresses, and fracture properties of silicon microelementsJournal of Applied Physics, 1989
- Analysis of thermal stress-induced grain boundary cavitation and notching in narrow Al-Si metallizationsApplied Physics Letters, 1988
- Fracture testing of silicon microelements i n s i t u in a scanning electron microscopeJournal of Applied Physics, 1988
- A model for stress-induced metal notching and voiding in very large-scale-integrated Al–Si (1%) metallizationJournal of Vacuum Science & Technology B, 1987
- Stress analysis of encapsulated fine-line aluminum interconnectApplied Physics Letters, 1987
- Stress-induced grain boundary fractures in Al–Si interconnectsJournal of Vacuum Science & Technology B, 1987