RF, Analog and Mixed Signal Technologies for Communication ICs - An ITRS Perspective

Abstract
The International Technology Roadmap for Semiconductor (ITRS) Radio Frequency and Analog/Mixed-Signal (RF and AMS) Wireless Technology Working Group (TWG) addresses device technologies for wireless communications covering both silicon and III-V compound semiconductors. This paper discussed the roadmap and the figures of merit (FoM) used to characterize both active and passive devices critical for typical radio front end designs. The trends, challenges and potential solutions was reviewed and address the intersection of silicon and III-V compound semiconductors

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