Fabrication of silicon cones and pillars using rough metal films as plasma etching masks
- 10 March 1999
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 74 (11) , 1627-1629
- https://doi.org/10.1063/1.123638
Abstract
We have developed a simple fabrication process which allows the production of nanoscale silicon structures. Rough silver films are used as an etching mask for reactive ion etching at 10 °C. Variation of the etching parameters, such as the rf power, allows control over the shape of the features; the production of both pillars and cones is possible. The density and diameter of these features are controlled by the etching time. Pillars with diameters as small as 5 nm are reported.Keywords
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