Abstract
In the SiH4‐HCl‐AsH3‐H2 system of depositing epitaxial silicon doped with arsenic an equilibrium‐like doping process has been obtained by way of experiments not only as a limiting case at high deposition temperatures, as had been shown formerly, but also in the range of lower temperatures when the layer growth rate falls below a critical value. By means of introducing the term of a critical rate the theory of dopant incorporation, published in the Parts I–IV of the present report, has been extended to full completeness.