Thermal simulation of thin-film interconnect failure caused by high current pulses
- 1 July 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 42 (7) , 1386-1388
- https://doi.org/10.1109/16.391228
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
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