Effect of 0.5 wt % Cu in Sn−3.5%Ag Solder on the Interfacial Reaction with Au/Ni Metallization
- 22 October 2003
- journal article
- research article
- Published by American Chemical Society (ACS) in Chemistry of Materials
- Vol. 15 (23) , 4340-4342
- https://doi.org/10.1021/cm034692c
Abstract
No abstract availableThis publication has 21 references indexed in Scilit:
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