Parallel-gap welding to very-thin metallization for high temperature microelectronic interconnects
- 1 June 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (2) , 376-382
- https://doi.org/10.1109/33.56171
Abstract
No abstract availableKeywords
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