Abstract
The properties of negative ions, such as charging–free ion implantation and new materials syntheses by pure kinetic bonding reaction, have been shown to be promising in terms of their interaction with material surfaces. However, high‐current or high‐brightness negative‐ion sources are required for these purposes. Several kinds of sputter‐type negative‐ion sources have been developed for negative‐ion implantation and deposition in order to obtain high‐current heavy negative ions. Recently, a microwave discharge oxygen negative‐ion source for negative‐ion beam deposition and a surface plasma type hydrogen negative‐ion source for projection ion‐beam lithography have been investigated. In this article, these negative‐ion sources for modification of materials are reviewed.

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