Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles
- 1 September 2001
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 30 (9) , 1073-1082
- https://doi.org/10.1007/s11664-001-0132-x
Abstract
No abstract availableKeywords
This publication has 17 references indexed in Scilit:
- Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5Ag composite soldersSoldering & Surface Mount Technology, 2001
- Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping techniqueJournal of Electronic Materials, 1999
- Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term agingJournal of Electronic Materials, 1999
- Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcementsJournal of Electronic Materials, 1999
- New, creep-resistant, low melting point solders with ultrafine oxide dispersionsJournal of Electronic Materials, 1998
- Hard‐particle Reinforced Composite Solders Part 1: MicrocharacterisationSoldering & Surface Mount Technology, 1997
- Metallurgy of low temperature Pb-free solders for electronic assemblyInternational Materials Reviews, 1995
- The growth of Cu-Sn intermetallics at a pretinned copper-solder interfaceMetallurgical Transactions A, 1992
- Processing dispersion-strengthened SnPb solders to achieve microstructural refinement and stabilityScripta Metallurgica et Materialia, 1991
- Composite soldersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991