Detailed characterization of anodic bonding process between glass and thin-film coated silicon substrates
- 16 October 2000
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 86 (1-2) , 103-107
- https://doi.org/10.1016/s0924-4247(00)00418-0
Abstract
No abstract availableKeywords
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