The use of organosilicon polymers in multilayer plasma resist processing
- 31 December 1987
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 6 (1-4) , 453-460
- https://doi.org/10.1016/0167-9317(87)90073-6
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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- Effect of Sn in plasma copolymerized methylmethacrylate and tetramethyltin resist on plasma development for x-ray irradiationJournal of Vacuum Science & Technology B, 1986
- Selective removal of metal atoms in hydrogen reactive ion etchingJournal of Vacuum Science & Technology B, 1986
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- Mechanism of oxygen plasma etching of polydimethyl siloxane filmsApplied Physics Letters, 1985
- Advances in the design of organic resist materialsMicroelectronic Engineering, 1983
- Organosilicon monomers for plasma-developed x-ray resistsJournal of Vacuum Science and Technology, 1981