Materials and Processes for Reliable Soldering of Chip Components

This publication has 9 references indexed in Scilit:

• Analysis of Surface Mount Thermal and Thermal Stress Performance
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
• The Effects of Entrapped Bubbles in Solder Used for the Attachment of Leadless Ceramic Chip Carriers
  8th Reliability Physics Symposium, 1983
• Surface Phenomena in Electronics Interconnection Technology-A Review
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1982
• Mounting Leadless Chip Carriers onto Printed Circuit Boards
  Microelectronics International, 1982
• Optical and Auger Microanalyses of Solder Adhesion Failures in Printed Circuit Boards
  Journal of the Electrochemical Society, 1981
• Progress in and Technology of Low-Cost Silver Containing Thick-Film Conductors
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980
• Low Expansivity Organic Substrate for Flip-Chip Bonding
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979
• Reliability of Controlled Collapse Interconnections
  IBM Journal of Research and Development, 1969
• Contact Angle Hysteresis
  Published by American Chemical Society (ACS) ,1964