On the profile design and optimization of epitaxial Si- and SiGe-base bipolar technology for 77 K applications. I. Transistor DC design considerations
- 1 March 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 40 (3) , 525-541
- https://doi.org/10.1109/16.199358
Abstract
No abstract availableThis publication has 36 references indexed in Scilit:
- Switching characteristics of poly bipolar circuits at liquid nitrogen temperaturePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- SiGe-base heterojunction bipolar transistors: physics and design issuesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Low temperature operation of Si and SiGe bipolar transistorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- 50-GHz self-aligned silicon bipolar transistors with ion-implanted base profilesIEEE Electron Device Letters, 1990
- 75-GHz f/sub T/ SiGe-base heterojunction bipolar transistorsIEEE Electron Device Letters, 1990
- Low-temperature avalanche multiplication in the collector-base junction of advanced n-p-n transistorsIEEE Transactions on Electron Devices, 1990
- Graded-SiGe-base, poly-emitter heterojunction bipolar transistorsIEEE Electron Device Letters, 1989
- Injection-induced bandgap narrowing and its effects on the low-temperature operation of silicon bipolar transistorsIEEE Transactions on Electron Devices, 1989
- A high-current-gain low-temperature pseudo-HBT utilizing a sidewall base-contact structure (SICOS)IEEE Electron Device Letters, 1989
- Bipolar circuit scalingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1979