On the origin of compressive stress in PVD coatings — an explicative model
- 1 September 1991
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 46 (3) , 265-274
- https://doi.org/10.1016/0257-8972(91)90169-w
Abstract
No abstract availableThis publication has 19 references indexed in Scilit:
- Structure of Titanium Nitride coatings deposited by physical vapour deposition: A unified structure modelSurface and Coatings Technology, 1988
- Intrinsic stress in A1N prepared by dual-ion-beam sputteringThin Solid Films, 1987
- Structure, internal stresses, adhesion and wear resistance of sputtered alumina coatingsThin Solid Films, 1987
- Stress control in reactively sputtered AlN and TiN filmsJournal of Vacuum Science & Technology A, 1987
- States of residual stress both in films and in their substratesJournal of Vacuum Science & Technology A, 1986
- Residual Compressive Stresses in Ti(C, N) Layer Deposited on Cemented Carbide by the Ion-Plating (PVD) ProcessJournal of the Japan Institute of Metals and Materials, 1985
- Stress and property control in sputtered metal films without substrate biasThin Solid Films, 1983
- Internal stress in aluminium oxide, titanium carbide and copper films obtained by planar magnetron sputteringThin Solid Films, 1981
- Residual compressive stress in sputter-deposited TiC films on steel substratesThin Solid Films, 1981
- Internal stresses in metallic films deposited by cylindrical magnetron sputteringThin Solid Films, 1979