Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects
- 1 April 2004
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 33 (4) , 321-328
- https://doi.org/10.1007/s11664-004-0138-2
Abstract
No abstract availableKeywords
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