A quarter-micrometer interconnection technology using a TiN/Al-Si-Cu/TiN/Al-Si-Cu/TiN/Ti multilayer structure
- 1 January 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 40 (2) , 296-302
- https://doi.org/10.1109/16.182504
Abstract
No abstract availableThis publication has 19 references indexed in Scilit:
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