Mechanical failure in COB-technology using glob-top encapsulation
- 1 October 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C
- Vol. 19 (4) , 232-240
- https://doi.org/10.1109/3476.558549
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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