Etching of polymers by oxygen plasmas: Influence of viscoelastic properties
- 4 March 1991
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 58 (9) , 959-961
- https://doi.org/10.1063/1.104455
Abstract
A study of novolac polymer etching in an oxygen microwave multipolar plasma with independent rf wafer biasing is reported. A step-like etch rate variation with temperature is observed for these polymers. Experiments conducted on chemically identical novolacs with different molecular weights allow this phenomenon to be correlated with their glass transition temperatures. Etch rate variations are caused by the thermal effect of ion bombardment, emphasizing the role of viscoelastic properties in polymer plasma etching.Keywords
This publication has 19 references indexed in Scilit:
- Free volume and relaxation effects in polymer layers: application to the spin coating and bake processesMicroelectronic Engineering, 1990
- Oxygen plasma etching for resist stripping and multilayer lithographyJournal of Vacuum Science & Technology B, 1989
- Etching mechanisms of polymers in oxygen microwave multipolar plasmasApplied Physics Letters, 1988
- Mechanistic studies of oxygen plasma etchingJournal of Vacuum Science & Technology B, 1988
- High Rate Photoresist Stripping in an Oxygen AfterglowJournal of the Electrochemical Society, 1986
- Oxidative Removal of Photoresist by Oxygen/Freon® 116 Discharge ProductsJournal of the Electrochemical Society, 1984
- Application of EPR Spectroscopy to Oxidative Removal of Organic MaterialsJournal of the Electrochemical Society, 1983
- Dry Etching of Polyimide in O 2 ‐ CF 4 and O 2 ‐ SF 6 PlasmasJournal of the Electrochemical Society, 1983
- Plasma etching durability of poly(methyl methacrylate)Journal of Applied Polymer Science, 1981
- Additives That Improve Positive Resist Durability for Plasma EtchingJournal of the Electrochemical Society, 1980