Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
Top Cited Papers
- 1 June 2002
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 31 (6) , 584-590
- https://doi.org/10.1007/s11664-002-0129-0
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Pb-free solders for flip-chip interconnectsJOM, 2001
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloysJournal of Electronic Materials, 2000
- Reactions of lead-free solders with CuNi metallizationsJournal of Electronic Materials, 2000
- Reactive isothermal solidification in the Ni–Sn systemActa Materialia, 1998
- Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich soldersJournal of Electronic Materials, 1996