Progress in speed power performance of bipolar technology by sub-10 keV B implantation into amorphized Si
- 4 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- Vertical scaling of the polysilicon emitter/implanted base structurePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- A sub-30 psec Si bipolar LSI technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- 75-GHz f/sub T/ SiGe-base heterojunction bipolar transistorsIEEE Electron Device Letters, 1990
- Defect formation in silicon at a mask edge during crystallization of an amorphous implantation layerJournal of Applied Physics, 1989
- A 1- mu m polysilicon self-aligning bipolar process for low-power high-speed integrated circuitsIEEE Electron Device Letters, 1989
- Shallow junction formation by boron implantation with energies between 2 and 5 keV and rapid thermal annealingNuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1989
- SHALLOW DOPING PROFILES FOR HIGH-SPEED BIPOLAR TRANSISTORSLe Journal de Physique Colloques, 1988
- Optimization of the germanium preamorphization conditions for shallow-junction formationIEEE Transactions on Electron Devices, 1988
- A systematic analysis of defects in ion-implanted siliconApplied Physics A, 1988
- Substrate-orientation dependence of the epitaxial regrowth rate from Si-implanted amorphous SiJournal of Applied Physics, 1978