Abstract
The differential MBE technique is suggested as a tool for separation or interconnection of advanced devices on a common chip. Bipolar diodes with various diameters of 23 to 800 mu m were fabricated and their electrical behaviour measured. Implantation of etching methods were used to eliminate the influence of a highly doped contact layer on top of the epitaxial layer sequence. Leakage currents from 10-7 to 10-9 A are slightly higher than those of reference mesa diodes. It is estimated that the differential technique is applicable to many advanced devices for planar integration.