Newly Packaged 50-µm-Spaced 8-Element Laser Diode Array with a Thermoelectric Cooler

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Abstract
We report that the junction temperature of individually addressable high-power laser diode elements in an array can be reduced by adjusting cavity length and by mounting the array in a copper package that has a thermoelectric cooler and cooling fins. We fabricated a 50-µm-spaced 8-element array and verified its low thermal interaction. We also experimentally evaluated the cooling characteristics of the new package: when all array elements operate simultaneously and continuously at 50 mW, the measured temperature reduction achieved with this package corresponds to an 8-fold increase in array lifetime.