Electromigration in Al-Cu thin films with polyimide passivation
- 1 May 1982
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 91 (2) , 175-182
- https://doi.org/10.1016/0040-6090(82)90431-x
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
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- The effects of dielectric overcoating on electromigration in aluminum interconnectionsIEEE Transactions on Electron Devices, 1969