The physics of excess electron velocity in submicron-channel FET’s
- 1 November 1977
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 48 (11) , 4791-4798
- https://doi.org/10.1063/1.323496
Abstract
A transport‐equation model is used to examine the processes by which the velocity of an electron injected from a source contact into an n channel can overshoot the saturated drift velocity by a factor of 3 or more (depending upon the material). The results agree semiquantitatively with earlier Monte Carlo calculations and show that the excess electron velocity can persist for distances on the order of 1 μm, with obvious benefit to the transit time of the carrier (and hence the fT) in submicron‐channel FET’s. Data for Ge, Si, and GaAs are given.This publication has 9 references indexed in Scilit:
- High performance MOS integrated circuit using the ion implantation techniqueIEEE Journal of Solid-State Circuits, 1975
- Frequency limits of GaAs and InP field-effect transistorsIEEE Transactions on Electron Devices, 1975
- Si and GaAs 0.5 μ m-gate Schottky-barrier field-effect transistorsElectronics Letters, 1973
- A two-dimensional analysis of gallium arsenide junction field effect transistors with long and short channelsSolid-State Electronics, 1972
- Electron dynamics in short channel field-effect transistorsIEEE Transactions on Electron Devices, 1972
- Ion implantation in semiconductor device technologyRadio and Electronic Engineer, 1972
- Voltage-current characteristics of GaAs J-FET's in the hot electron rangeSolid-State Electronics, 1970
- Measurement of high-field carrier drift velocities in silicon by a time-of-flight techniqueIEEE Transactions on Electron Devices, 1967
- Diffusion of Hot and Cold Electrons in Semiconductor BarriersPhysical Review B, 1962