Study of the microstructure of IC interconnect metallisations using analytical transmission electron microscopy and secondary ion mass spectrometry
- 1 November 1996
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 36 (11-12) , 1699-1702
- https://doi.org/10.1016/0026-2714(96)00177-1
Abstract
No abstract availableKeywords
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