Rapid thermal annealing of Ge-implanted InP

Abstract
Results from n-type doping by Ge implantation at 200 keV into 〈100〉 p-type InP are reported. The degree of recrystallization and electrical activity after capless annealing by rapid thermal annealing was investigated as a function of dose, implantation, and annealing temperature by a combination of Rutherford backscattering spectrometry/channeling, differential Hall/resistivity, and secondary-ion mass spectrometry measurements. Room-temperature implantations resulted in continuous amorphous layers even at a dose of 2×1013cm−2 in contrast to hot implantations at 200 °C where no amorphous layers were created even for a dose as high as 5×1014 cm−2. For the latter dose an activation percentage of 37 and a maximum carrier concentration of 1×1019 cm−3 were achieved after rapid thermal annealing at 830 °C for 1 s.

This publication has 13 references indexed in Scilit: