Interaction between electromigration and mechanical-stress-induced migration; New insights by a simple, wafer-level resistometric technique
- 1 March 1991
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 38 (3) , 469-475
- https://doi.org/10.1109/16.75155
Abstract
No abstract availableThis publication has 34 references indexed in Scilit:
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