Supplemental multilevel interconnects by laser direct writing: Application to GaAs digital integrated circuits
- 13 April 1987
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 50 (15) , 1016-1018
- https://doi.org/10.1063/1.97993
Abstract
A nonperturbing sequence of laser direct-writing processes is described for applying supplemental multilevel interconnects on partially or fully fabricated circuits. The approach adds multiple levels of laser direct-written tungsten metallization and is demonstrated here for the assembly of a simple latch circuit on a standard GaAs digital test chip. Principal applications are for subsystem verification, device testing, restructuring, and fault avoidance on Si and GaAs circuits.Keywords
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