Simulation toolbox and material parameter data base for CMOS MEMS
- 24 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
The CMOS MEMS CAD tools SOLIDIS and ICMAT are presented. The data base ICMAT is obtained from measuring process dependent CMOS thin film electrical, magnetic, thermal, and mechanical properties by using dedicated materials characterization microstructures. ICMAT is illustrated by thermophysical and mechanical properties of various CMOS layers and novel characterization structures for the thermopower of CMOS polysilicon and the heat capacity of CMOS layer sandwiches. The toolbox SOLIDIS provides coupled numerical modeling of the electrical, magnetic, and mechanical phenomena, and the boundary and interface conditions occurring in Microsystem Technology Computer Aided Design, or /spl mu/TCAD, in a uniform and consistent environment. An outline of /spl mu/TCAD and MEMS device simulation is given with a magnetic sensor and a deflectable micromirror serving as examples.Keywords
This publication has 13 references indexed in Scilit:
- Process-dependent Thermophysical Properties Of CMOS IC Thin FilmsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Double Pass Metallization For Cmos Aluminum ActuatorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- IC MEMS microtransducersPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Coupled 3D thermo-electro-mechanical simulations of microactuatorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Electrostatic aluminum micromirrors using double-pass metallizationJournal of Microelectromechanical Systems, 1997
- Microsystem CADPublished by SPIE-Intl Soc Optical Eng ,1996
- Thermal CMOS Sensors―an OverviewSensors Update, 1996
- Progress in Microsensor InterfacesSensors Update, 1996
- Numerical Modelling and Materials Characterisation for Integrated Micro Electro Mechanical SystemsPublished by Springer Nature ,1995
- Thermal conductivity of CMOS materials for the optimization of microsensorsJournal of Micromechanics and Microengineering, 1993